Tessera Inc. Friday will unveil a new ultra-thin tri-fold stacked chip-scale package (CSP) co-developed with Intel Corp. for that firm's highest-density flash memory. Bruce McWilliams, president and ...
Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...
Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
New York, June 16, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Chip Scale Package LED Market Research Report by Power Range, by Application - Global Forecast to 2025 ...
In a single chip-scale package (CSP) measuring only 1.4-mm in thickness, the company has managed to stack a PSRAM, one SRAM, and two flash memory chips, plus a spacer chip. Employing a proprietary ...
ROHM’s ultra-compact complementary metal–oxide–semiconductor (CMOS) operational amplifier (op amp) TLR1901GXZ achieves the ...
Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Staccato Communications says its Ripcord wafer chip-scale package offers the smallest form factor of any Certified Wireless USB-based solution available, reducing the space needed to implement an ...
Cold atom experiments are among the most powerful and precise ways of investigating and measuring the universe and exploring ...
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