SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) said today (April 28, 2003) it has developed a style of package it calls flip-chiip on standard leaded (FCOSL) packages. These ...
FREMONT, Calif. — ChipPAC Inc. today announced availability of an internally qualified gold stud-bump flip-chip packaging technology, which the company said reduces manufacturing time by 20-to-50% ...
High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...
A technical paper titled “Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin” was published by researchers at Delft University of Technology and NXP ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
IBM finds partners for flip chip packagesNews from E-InSiteIBM is working with Amkor Technology, Advanced Semiconductor Engineering, ASAT Holdings and ASAT to develop advanced flip chip substrates and ...
System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
CHANDLER, Ariz., Oct. 17, 2024 (GLOBE NEWSWIRE) -- Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4™ ...
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip ...
SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today the industry’s first Fan-Out ...
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