South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
MemryX has now signed an agreement with a next-generation 3D memory partner to execute a dedicated 2026 test chip program, validating a targeted 5um-class hybrid-bonded interface and direct-to-tile ...
As NAND flash and high-bandwidth memory (HBM) stacking technologies continue to advance, coupled with the prospective development of 3D DRAM, the semiconductor industry is abuzz with the rising ...
SAN JOSE, Calif.--(BUSINESS WIRE)-- Xperi Holding Corporation™ (NASDAQ: XPER) (“Xperi”) today announced that the company entered into a license agreement with Yangtze Memory Technologies Co., Ltd.
A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University.
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