Business Wire

Research and Markets: ST LIS3DH / Apple A2L 3-Axis MEMS Accelerometer Reverse Costing

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/8a522f/st_lis3dh__apple) has announced the addition of the "ST LIS3DH ...
Business Wire

Colibrys VS1000 Accelerometer: Technology Analysis - Research and Markets

DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Colibrys VS1000 Accelerometer: Technology Analysis" report to their offering. Safran Colibrys is the leading European ...
Electronic Design

Wafer-Level Bonding Technique Allows Cost-Effective MEMS Packaging

Packaging MEMS devices is a very challenging task that poses problems distinct from conventional ICs. Among the complexities is the need for protection from particulate contamination, moisture, ESD, ...
EDN

MEMS: Think outside the chip… at the package level

The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...
EurekAlert!

The design and fabrication of the proposed MEMS accelerometer. (IMAGE)

The design and fabrication of the proposed MEMS accelerometer. a Schematic diagram of the accelerometer with two-layered proof mass. The upper layer has flexures, stiffness tuning electrodes, and ...
Electronic Design

MEMS And 3D Packaging

As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...