According to MarketsandMarkets™, the global Hybrid Bonding Market is projected to reach USD 633.9 million by 2032 from USD 164.7 million in 2025, registering a CAGR of 21.2% from 2025 to 2032.

Key market opportunities for semiconductor silicon wafers lie in the growth across IT, automotive, and AI sectors. Advancements in wafer sizes and bonding methods, alongside innovative crystal growth ...

ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...

Brewer Science, Inc., announces the release of its second generation of spin-on polymeric temporary wafer bonding materials with superior bonded pair thermal stability. The Brewer Science WaferBOND™ ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

Learn how Bruker’s InSight systems ensure pristine wafer surfaces, improving bond integrity and yield in advanced semiconductor packaging.

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...